4. Semiconductor device manufacturing: process
  5. Packaging or treatment of packaged semiconductor

Paul A. Totta

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Chip contacts without oxide discontinuities

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Contact stud structure for semiconductor devices

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Electroplated solder terminal

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
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Electroplated solder terminal

Etching a substrate: processes – Forming or treating electrical conductor article
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Hybrid process for SBD metallurgies

Coating processes – Electrical product produced – Condenser or capacitor
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Profile ID: LFUS-PAI-P-197648

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