Electroplated solder terminal

Details Electroplated solder terminal Electroplated solder terminal

1994-06-28

1996-04-02

Dang, Thi

Etching a substrate: processes

Forming or treating electrical conductor article

216 18, 216 72, 216 75, 216 95, 216100, 216105, 1566561, 437183, H01L 2348, B23K 120

Patent

active

055032869

ABSTRACT:
A process for an improved solder terminal is disclosed. The improved solder terminal is made of a bottom metallic adhesion layer, a CrCu intermediate layer on top of the adhesion layer, a solder bonding layer above the CrCu layer and a solder top layer. The adhesion layer is either TiW or TiN. A process for fabricating an improved terminal metal consists of depositing an adhesive metallic layer, a layer of CrCu over the adhesive layer and a layer of solder bonding material, over which a solder layer is formed in selective regions and the underlying layers are etched using solder regions as a mask.

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