4. Dispensing
  5. Automatic control
  6. Constant weight, volume or pressure control by output

Nobuto Yamazaki

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Apparatus for manufacturing semiconductor devices

Metal fusion bonding – With means to juxtapose and bond plural workpieces – Wire lead bonder
Patent

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Ball detection method and apparatus for wire-bonded parts

Image analysis – Applications – Manufacturing or product inspection
Patent

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Bonding apparatus

Metal fusion bonding – Means to apply vibratory solid-state bonding energy to work
Patent

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Bonding apparatus

Electrical generator or motor structure – Non-dynamoelectric – Piezoelectric elements and devices
Patent

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Bonding method

Metal working – Method of mechanical manufacture – Electrical device making
Patent

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Profile ID: LFUS-PAI-P-11836

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