Apparatus for manufacturing semiconductor devices

Details Apparatus for manufacturing semiconductor devices Apparatus for manufacturing semiconductor devices

1989-06-30

1991-01-22

Heinrich, Sam

Metal fusion bonding

With means to juxtapose and bond plural workpieces

Wire lead bonder

228175, B23K 2000, H05K 300

Patent

active

049864602

ABSTRACT:
An apparatus for manufacturing semiconductor devices wherein a curing oven cures samples of dies bonded to lead frames by adhesives, a wire bonder which is installed adjacent to and in line with the curing oven wire-bonds the samples which have been cured in the curing oven, and a sample feeding mechanism feeds the samples to the curing oven and then to a wire-bonding section of the wire bonder; thus, there is no need for separate transport of the samples following curing or for repeated heating of the samples, and product reliability and productivity are improved. In addition, there is no need for a special curing oven or special measures to prevent oxidation following curing.

REFERENCES:
patent: 4301958 (1981-11-01), Hatakenaka et al.
patent: 4583676 (1986-04-01), Pena et al.

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