Bonding method

Details Bonding method Bonding method

1990-05-14

1991-08-20

Arbes, Carl J.

Metal working

Method of mechanical manufacture

Electrical device making

29833, 228 45, 2281802, 357 70, 437182, 437220, H01R 909

Patent

active

050402935

ABSTRACT:
A bonding method for bonding inner leads on a film to electrodes of semiconductor elements is performed by the steps of: individually positioning the film and semiconductor elements at a predetermined bonding position; individually recognizing the positions of the inner leads and electrodes; selecting a combination of one inner lead and one electrode which are positionally shifted relative to each other; correcting relative position of the inner lead and electrode which are positionally shifted so that the inner lead and electrode are aligned; the inner lead and electrode are bonded; relative positions of remaining inner leads and elctrodes are aligned; and the inner leads and elctrodes are individually connected by bonding.

REFERENCES:
patent: 3722072 (1973-03-01), Beyerlein
patent: 3941297 (1976-03-01), Burns et al.
patent: 4347964 (1982-09-01), Takasugi et al.
patent: 4415917 (1983-11-01), Chiba et al.
patent: 4838472 (1989-06-01), Scavino
patent: 4855928 (1989-08-01), Yamanaka

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