Ball detection method and apparatus for wire-bonded parts

Details Ball detection method and apparatus for wire-bonded parts Ball detection method and apparatus for wire-bonded parts

1997-08-13

1999-02-09

Au, Amelia

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Applications

Manufacturing or product inspection

382150, 228105, G06K 900

Patent

active

058704892

ABSTRACT:
A method and apparatus for determining the position, size and/or shape of a ball formed on a pad of a semiconductor chip when a wire is bonded between the pad and a lead of a lead frame. The ball is detected in at least three directions from the center of the ball towards the edge of the ball.

REFERENCES:
patent: 5189711 (1993-02-01), Weiss et al.
patent: 5456403 (1995-10-01), Nishimaki et al.
patent: 5459794 (1995-10-01), Ninomiya et al.
patent: 5550763 (1996-08-01), Michael et al.
patent: 5579984 (1996-12-01), Sasano
patent: 5581632 (1996-12-01), Koljonen
patent: 5592562 (1997-01-01), Rooks

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