Bonding apparatus

Electrical generator or motor structure – Non-dynamoelectric – Piezoelectric elements and devices

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Details

310328, 228 11, 2281101, H03H 905

Patent

active

054867339

ABSTRACT:
A bonding apparatus with an ultrasonic horn for manufacturing, for example, semiconductor devices having a horn support that is used for mounting the ultrasonic horn to a bonding arm of the bonding apparatus, and tow vibration-generating sources are provided on both sides of the horn support. The vibration-generating sources are such a piezoelectric element as an electrostrictive strain element and a magnetostrictor.

REFERENCES:
patent: 3184842 (1965-05-01), Maropis
patent: 3368085 (1968-02-01), McMaster et al.
patent: 3511323 (1970-05-01), Riley
patent: 3602420 (1971-08-01), Wilkinson
patent: 3681627 (1972-08-01), Murry et al.
patent: 3756575 (1973-09-01), Cottell
patent: 3772538 (1973-11-01), Supitilov
patent: 3931921 (1976-01-01), Antonevich
patent: 4290074 (1981-09-01), Royer
patent: 4647336 (1987-03-01), Coenen et al.
patent: 4975133 (1990-12-01), Gochermann
patent: 5148964 (1992-09-01), Shimizu
patent: 5176677 (1993-01-01), Wuchinich
"Straight Line Motion Of A Vibratory Bonding Tool" by F. Christensen et al. Western Electric Technical Digest No. 4, Oct. 1966, p. 21.
"Ultrasonic Bonding Tool" by P. Smith, IBM Technical Disclosure Bulletin, vol. 13, No. 10 Mar. 1971, p. 2862.

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