4. Electricity: conductors and insulators
  5. Conduits, cables or conductors
  6. Combined

Nippon Steel Materials Co., Ltd.

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Ball transferring method and apparatus

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Bonding wire for semiconductor device

Electricity: conductors and insulators – Conduits – cables or conductors – Combined
Reexamination Certificate

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Bonding wire for semiconductor device

Electricity: conductors and insulators – Conduits – cables or conductors – Combined
Reexamination Certificate

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Copper alloy bonding wire for semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Wire contact – lead – or bond
Reexamination Certificate

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Gold wire for connecting semiconductor chip

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2205250

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