Gold wire for connecting semiconductor chip

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum

Reexamination Certificate

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Details

C257S784000, C257SE23025, C420S507000, C174S126100

Reexamination Certificate

active

07830008

ABSTRACT:
Gold wire for connecting a semiconductor chip basically containing praseodymium in 0.0004 mass % to 0.02 mass % in range and, considering the bonding characteristics, containing beryllium or aluminum or both in limited ranges and, considering the precipitates formed in the gold wire, further containing auxiliary additive elements of calcium, lanthanum, cerium, neodymium, and samarium in limited ranges.

REFERENCES:
patent: 5702814 (1997-12-01), Hanada et al.
patent: 6103025 (2000-08-01), Herklotz et al.
patent: 6165627 (2000-12-01), Miyazaki et al.
patent: 2005/0013724 (2005-01-01), Ougi et al.
patent: 58-096741 (1983-06-01), None
patent: 58-96741 (1983-06-01), None
patent: 58-154242 (1983-09-01), None
patent: 1-198438 (1989-08-01), None
patent: 04-284821 (1992-10-01), None
patent: 4-284821 (1992-10-01), None
patent: 9-36161 (1997-02-01), None
patent: 9-74113 (1997-03-01), None
patent: 2621288 (1997-04-01), None
patent: 2661247 (1997-06-01), None
patent: 2680414 (1997-08-01), None
patent: 2766706 (1998-04-01), None
patent: 2773202 (1998-04-01), None
patent: 2814660 (1998-08-01), None
patent: 3337049 (2002-08-01), None

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