Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate
2007-10-23
2007-10-23
Lebentritt, Michael (Department: 2812)
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
To form ohmic contact to semiconductive material
C438S615000, C438S616000, C257SE21508
Reexamination Certificate
active
11094051
ABSTRACT:
Balls are sucked onto a carrier board so as to be temporarily arranged in a ball arrangement region of the board, and then the balls are transferred and bonded onto an objective substance with their positions being adjusted. Gas blow is applied to the temporarily arranged balls or alternatively the temporarily arranged balls are sucked, so as to remove excess balls other than balls that have been exactly sucked onto the ball arrangement region. Cooperation with application of fine vibration to the carrier board makes the removal of the excess balls more efficient.
REFERENCES:
patent: 5431332 (1995-07-01), Kirby et al.
patent: 5657528 (1997-08-01), Sakemi et al.
patent: 5687901 (1997-11-01), Hoshiba et al.
patent: 5867260 (1999-02-01), Sakai
patent: 6595408 (2003-07-01), Cobbley et al.
patent: 6607118 (2003-08-01), Cheng et al.
patent: 8-112671 (1996-05-01), None
patent: 7-153765 (1996-06-01), None
patent: 11-040615 (1999-02-01), None
patent: 11-111767 (1999-04-01), None
patent: 11-224917 (1999-08-01), None
patent: 2000-12593 (2000-01-01), None
patent: 2000-232132 (2000-08-01), None
Hashino Eiji
Shimokawa Kenji
Tatsumi Kohei
Kenyon & Kenyon LLP
Lebentritt Michael
Lee Cheung
Nippon Steel Materials Co., Ltd.
LandOfFree
Ball transferring method and apparatus does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Ball transferring method and apparatus, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Ball transferring method and apparatus will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3895384