Active solid-state devices (e.g., transistors, solid-state diode
Responsive to non-electrical signal
Temperature
Examiner
active
No affiliations
Bumped semiconductor device with alignment features and method f
Chip package device mountable on a mother board in whichever of
Chip scale ball grid array for integrated circuit packaging
CMOS structure with varying gate oxide thickness and with both d
Compound semiconductors and a method for thin film growth
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Profile ID: LFUS-PAI-P-57208