4. Metal fusion bonding
  5. Process
  6. Using high frequency vibratory energy

Mutsumi Masumoto

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Back side coating of semiconductor wafers

Active solid-state devices (e.g. – transistors – solid-state diode – With means to control surface effects – Insulating coating
Reexamination Certificate

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Flip-chip semiconductor device manufacturing method

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
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Method for manufacturing a semiconductor device

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Method for packaging a low profile semiconductor device

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate

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Method for producing a semiconductor package, with a...

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2070870

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