4. Electricity: conductors and insulators
  5. Conduits, cables or conductors
  6. Preformed panel circuit arrangement

Muneharu Ohara

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Adhesive for copper foils and an adhesive-applied copper foil

Stock material or miscellaneous articles – Web or sheet containing structurally defined element or... – Adhesive outermost layer
Patent

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Copper foil for a printed circuit board, a process and an appara

Chemistry: electrical and wave energy – Apparatus – Electrolytic
Patent

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Copper foil for a printed circuit board, a process and an appara

Electrolysis: processes – compositions used therein – and methods – Electroforming or composition therefor – Sheet – web – wire – or filament
Patent

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Method of making multilayer printed wiring board

Metal working – Method of mechanical manufacture – Electrical device making
Patent

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Multilayer printed wiring board

Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement
Patent

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Profile ID: LFUS-PAI-P-924715

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