Copper foil for a printed circuit board, a process and an appara

Details Copper foil for a printed circuit board, a process and an appara Copper foil for a printed circuit board, a process and an appara

1996-10-31

1998-11-10

Gorgos, Kathryn L.

Chemistry: electrical and wave energy

Apparatus

Electrolytic

204212, 204231, 204278, C25D 1700

Patent

active

058338195

ABSTRACT:
This invention provides a process for producing an electrolytic copper foil for a printed wiring board by supplying current between a rotary cathode and an electrolytic anode in a copper electrolyte so as to electrodeposit copper on the surface of the rotary cathode, wherein an anode for high electric current is placed opposite to the electrodeposition starting surface of the rotary cathode in such a manner that a part of the anode is projected above a liquid level of the copper electrolyte, and the copper electrolyte existing between the anode for high electric current and the opposed rotary cathode surface is electrolyzed by providing a high electric current with a current density higher than that of the electrolytic anode, and an apparatus for producing an electrolytic copper foil for a printed wiring board having excellent properties.

REFERENCES:
patent: 3483113 (1969-12-01), Carter
patent: 3567595 (1971-03-01), Yates
patent: 3901785 (1975-08-01), Buzhinskaya et al.
patent: 4898647 (1990-02-01), Luce et al.
Patent Abstracts of Japan, vol. 013, No. 107 (C-576), Mar. 14, 1989 and JP 63 282288 A (Furukawa Saakitsuto Fuoiru KK), Nov. 18, 1988, "abstract".

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