Copper foil for a printed circuit board, a process and an appara

Electrolysis: processes – compositions used therein – and methods – Electroforming or composition therefor – Sheet – web – wire – or filament

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205111, C25D 104

Patent

active

059977108

ABSTRACT:
This invention provides a process for producing an electrolytic copper foil for a printed wiring board by supplying current between a rotary cathode and an electrolytic anode in a copper electrolyte so as to electrodeposit copper on the surface of the rotary cathode, wherein an anode for high electric current is placed opposite to the electrodeposition starting surface of the rotary cathode in such a manner that a part of the anode is projected above a liquid level of the copper electrolyte, and the copper electrolyte existing between the anode for high electric current and the opposed rotary cathode surface is electrolyzed by providing a high electric current with a current density higher than that of the electrolytic anode, and an apparatus for producing an electrolytic copper foil for a printed wiring board having excellent properties.

REFERENCES:
patent: 3483113 (1969-12-01), Carter
patent: 3901785 (1975-08-01), Buzhinskaya et al.
patent: 5326455 (1994-07-01), Kubo et al.

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