Multilayer printed wiring board

Details Multilayer printed wiring board Multilayer printed wiring board

1997-07-10

1999-09-28

Ledynh, Bot

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

174256, 174250, 361748, 428344, H05K 100

Patent

active

059592567

ABSTRACT:
A multilayer printed wiring board wherein circuits are provided respectively on both the faces of a substrate and subsequent circuits are provided in order and via insulating layers respectively on the outsides of the preceding circuits, characterized in that the insulating layers comprise an epoxy resin, polyvinyl acetal resin, melamine or urethane resin and rubber-modified epoxy resin in a specific mixing ratio.

REFERENCES:
patent: 3936575 (1976-02-01), Watanabe et al.
patent: 4902551 (1990-02-01), Nakaso et al.
patent: 4985294 (1991-01-01), Watanabe et al.
patent: 5153987 (1992-10-01), Takahashi et al.
patent: 5268064 (1993-12-01), Woo et al.
patent: 5674611 (1997-10-01), Saida et al.
patent: 5707729 (1998-01-01), Satoh

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