Adhesive for copper foils and an adhesive-applied copper foil

Details Adhesive for copper foils and an adhesive-applied copper foil Adhesive for copper foils and an adhesive-applied copper foil

1995-05-08

1997-10-07

Lee, Helen

Stock material or miscellaneous articles

Web or sheet containing structurally defined element or...

Adhesive outermost layer

B32B 712, B32B 1504

Patent

active

056746113

ABSTRACT:
An adhesive for copper foils which comprises 40-70% by weight of an epoxy resin, 20-50% by weight of a polyvinyl acetal resin and 0.1-20% weight of a melamine or urethane resin, all of said resins totalling 100% by weight, with the proviso that 5-80% by weight of said epoxy resin is a rubber-modified epoxy resin; and
An adhesive-applied copper foil having said adhesive attached onto its one face.

REFERENCES:
patent: 3936575 (1976-02-01), Watanabe et al.
patent: 4486505 (1984-12-01), Fushiki et al.
patent: 4560579 (1985-12-01), Siadat et al.
patent: 4586976 (1986-05-01), Takano et al.
patent: 4593052 (1986-06-01), Irving
patent: 4985294 (1991-01-01), Watanabe et al.
patent: 5153987 (1992-10-01), Takahashi et al.
patent: 5292812 (1994-03-01), Yamazaki et al.
patent: 5365656 (1994-11-01), Dahringer et al.
patent: 5403869 (1995-04-01), Arike et al.

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