Method of making multilayer printed wiring board

Details Method of making multilayer printed wiring board Method of making multilayer printed wiring board

1995-08-17

1998-02-17

Arbes, Carl J.

Metal working

Method of mechanical manufacture

Electrical device making

29830, 174258, H05K 302

Patent

active

057180393

ABSTRACT:
A process for preparing said multilayer printed wiring board comprising the steps of (1) adhering copper foils respectively to both the faces of a substrate, masking and etching said foils in a usual way to form circuits, (2) applying copper foils having a semi-cured insulating layer formed on one face thereof respectively to said circuits with the insulating layer facing to said circuit, the insulating layers being as defined above, and then pressing the whole together under heat and (3) masking and etching the copper foils with the insulating layer thereon in a usual way to form circuits, the steps (2) and (3) being repeated as many times as desired.

REFERENCES:
patent: 3932689 (1976-01-01), Watanabe et al.
patent: 4804575 (1989-02-01), Kohm
patent: 5120384 (1992-06-01), Yoshimitsu et al.
patent: 5153987 (1992-10-01), Takahashi et al.
patent: 5179777 (1993-01-01), Suzuki
patent: 5220723 (1993-06-01), Okaka
patent: 5318651 (1994-06-01), Matsui et al.

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