4. Metal fusion bonding
  5. Process
  6. Plural joints

Ming-Ren Lin

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Advanced copper interconnect system that is compatible with exis

Metal fusion bonding – Process – Plural joints
Patent

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CMOS optimization method utilizing sacrificial sidewall spacer

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate
Patent

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Copper pellet for reducing electromigration effects associated w

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Patent

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Copper pellet for reducing electromigration effects associated w

Fishing – trapping – and vermin destroying
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Copper reservoir for reducing electromigration effects associate

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
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Profile ID: LFUS-PAI-P-43326

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