Metal fusion bonding – Process – Plural joints
Patent
1995-11-29
1998-07-28
Heinrich, Samuel M.
Metal fusion bonding
Process
Plural joints
228208, 438637, 438688, 29874, H01L 2160
Patent
active
057852367
ABSTRACT:
A process is provided which enables electrical connection to be formed between gold and aluminum wires and copper interconnects. Conventional techniques for wire bonding are ineffective for bonding gold wires or aluminum wires to copper pads or copper interconnects. A process is provided to modify the copper pads so that conventional wire bonding techniques can be employed. In the process of the present invention an aluminum pad is formed over the copper interconnects. The metal wire is then bonded to the aluminum pad using conventional wire bonding techniques. No new hardware and/or technology is required for the metal wire bonding. No new technology is required to integrate the process of the invention into existing IC fabrication processes.
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patent: 5659201 (1997-08-01), Wollesen
Metals Handbook Ninth Edition, vol. 6, "Solid State Welding, Metallurgical Considerations, Interlayers", 1983.
Cheung Robin W.
Lin Ming-Ren
Advanced Micro Devices , Inc.
Heinrich Samuel M.
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