Copper pellet for reducing electromigration effects associated w

Details Copper pellet for reducing electromigration effects associated w Copper pellet for reducing electromigration effects associated w

1996-01-24

1997-06-17

Niebling, John

Fishing, trapping, and vermin destroying

437192, 437198, 1566431, H01L 21283

Patent

active

056396910

ABSTRACT:
A multilayer semiconductor structure includes a conductive via. The conductive via includes a pellet of metal having a high resistance to electromigration. The pellet is made from a conformal layer of copper or gold deposited over the via to form a copper or gold reservoir or contact located in the via. A barrier layer is provided between the reservoir and an insulating layer to prevent the pellet from diffusing into the insulating layer. The pellet can be formed by selective deposition or by etching a conformal layer. The conformal layer can be deposited by sputtering, collimated sputtering, chemical vapor deposition (CVD), dipping, evaporating, or by other means. The barrier layer and pellet may be etched by anisotropic dry etching, plasma-assisted etching, or other layer removal techniques.

REFERENCES:
patent: 5243222 (1993-09-01), Harper et al.
patent: 5442235 (1995-08-01), Parrillo et al.
patent: 5476814 (1995-12-01), Ohshima et al.

Affiliated with

Also associated with

Rating

Copper pellet for reducing electromigration effects associated w does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Copper pellet for reducing electromigration effects associated w, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Copper pellet for reducing electromigration effects associated w will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2157548