4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Combined with electrical contact or lead
  6. Flip chip

Ming-Lun Ho

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active

Chip package structure with dual heat sinks

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate

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Flip chip package structure

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip
Reexamination Certificate

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Flip chip stacked package

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip
Reexamination Certificate

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Method for flip chip bonding by utilizing an interposer with...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
Reexamination Certificate

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Process of cutting electronic package

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Making plural separate devices
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Profile ID: LFUS-PAI-P-2942168

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