Process of cutting electronic package

Details Process of cutting electronic package Process of cutting electronic package

2007-05-22

2007-05-22

Nguyen, Tuan H. (Department: 2813)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Making plural separate devices

C438S464000

Reexamination Certificate

active

10904405

ABSTRACT:
The present invention provides a cutting process for cutting connected electronic package structures. The connected electronic package structures are connected through a mother carrier. Each electronic package structures includes at least an electronic component and a carrier unit, while the mother carrier includes at least a plurality of carrier units and a plurality of cutting regions, each cutting region being disposed between two adjacent carrier units. After forming at least a supporting portion on the first surface of the mother carrier and on a portion of the cutting region of the mother carrier, the mother carrier is positioned to a supportive plane, so that the supporting portion is in contact with the supportive plane. From a second surface of the mother carrier, cutting the mother carrier at the cutting regions, so that the electronic package structures alongside the cutting regions are separated.

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patent: 2003/0207498 (2003-11-01), Islam et al.
patent: 2005/0012183 (2005-01-01), Chow et al.

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