Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
Reexamination Certificate
2006-08-29
2006-08-29
Lebentritt, Michael (Department: 2812)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
C438S107000
Reexamination Certificate
active
07098071
ABSTRACT:
The present invention relates to a method for flip chip bonding by utilizing an interposer with embedded bumps. The method comprises (a) providing a first element having a first surface; (b) forming an interposer onto the first surface; (c) forming a plurality of openings on the interposer; (d) forming a plurality of bumps in the openings, wherein the height of the bumps is smaller than the depth of the openings; (e) providing a second element having a plurality of pre-solders; and (f) bonding the first surface onto the second element, so that the pre-solders are disposed in the openings and in contact with the bumps. As a result, the self-alignment between the pre-solders and the bumps can avoid the shift between the first element and the second element.
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Chung Chih-Ming
Ho Ming-Lun
Advanced Semiconductor Engineering Inc.
Ladas & Parry LLP
Lebentritt Michael
Stevenson Andre′ C.
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