4. Coating processes
  5. Coating by vapor, gas, or smoke
  6. Base includes an inorganic compound containing silicon or...

Melissa E. Grupen-Shemansky

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Method for coupling substrates and structure

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Insulative housing or support
Patent

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Method for thinning a semiconductor wafer

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent

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Method of bonding silicon and III-V semiconductor materials

Fishing – trapping – and vermin destroying
Patent

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Nonconductive laminate for coupling substrates and method...

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Reexamination Certificate

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Selective deposition of polycrystalline silicon

Coating processes – Coating by vapor – gas – or smoke – Base includes an inorganic compound containing silicon or...
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Profile ID: LFUS-PAI-P-770711

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