Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Insulative housing or support
Patent
1996-05-28
2000-02-08
Picardat, Kevin M.
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Insulative housing or support
438106, 438118, 438127, H01L 2144, H01L 2148, H01L 2150
Patent
active
060227613
ABSTRACT:
A method for connecting substrates includes using an adhesive interposer structure (11) to bond a semiconductor device (26) to a substrate (18). The adhesive interposer structure (11) includes a non-conductive adhesive laminant (12) and conductive adhesive bumps (13). The conductive adhesive bumps (13) provide a conductive path between conductive bumps (27) on the semiconductor device (26) and conductive metal pads (21) located on the substrate (18). In an alternative embodiment, a conductive adhesive material (34) is screen or stencil printed into vias (39) located on a printed circuit board (38) to form conductive adhesive bumps (33). A non-conductive adhesive (52) is then screen or stencil printed onto the printed circuit board (38) adjacent the conductive adhesive bumps (33). A semiconductor die is then connected to the structure.
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Grupen-Shemansky Melissa E.
Lin Jong-Kai
Tessier Theodore G.
Collins D. Mark
Huffman A. Kate
Jackson Kevin B.
Motorola Inc.
Picardat Kevin M.
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