4. Semiconductor device manufacturing: process
  5. Introduction of conductivity modifying dopant into...
  6. Diffusing a dopant

Marcantonio Mangiagli

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Integrated structure pad assembly for lead bonding

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Configuration or pattern of bonds
Patent

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Integrated structure pad assembly for lead bonding

Semiconductor device manufacturing: process – Introduction of conductivity modifying dopant into... – Diffusing a dopant
Patent

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Process for encapsulating a semiconductor device having a heat s

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Patent

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Resin-encapsulated semiconductor device having improved adhesion

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated
Patent

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Semiconductor device having alternating electrically...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Outside periphery of package having specified shape or...
Reexamination Certificate

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Profile ID: LFUS-PAI-P-1316380

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