Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Outside periphery of package having specified shape or...
Reexamination Certificate
1994-03-23
2001-11-20
Lee, Eddie (Department: 2815)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Outside periphery of package having specified shape or...
C257S666000, C257S668000, C257S690000, C257S691000, C257S692000, C257S693000, C257S696000, C257S725000, C257S734000, C257S787000, C257S797000, C257S798000
Reexamination Certificate
active
06320258
ABSTRACT:
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to a semiconductor device encapsulated in resin and completely insulated for high voltages.
2. Description of the Prior Art
Semiconductor devices encapsulated in resin, completely insulated, and capable of resisting voltages up to 1500 V AC are known. An example of such a device is illustrated in U.S. Pat. No. 4,888,307. FIG. 12 of such patent is reproduced herein as FIG.
1
.
Such devices are not suited for use in the range of high voltages, because, in such high ranges, they do not comply with international electrical insulation and safety standards. This is particularly true for very small electrically insulated packages containing semiconductor chips. An example of such a package is known internationally by the designation “TO 220”. Other packages of the same dimensions have the same problem.
SUMMARY OF THE INVENTION
One object of the present invention is to provide a semiconductor device encapsulated in resin and completely insulated, capable of resisting high voltages of at least 2250 V AC. In one embodiment the invention proposes to provide devices with the same overall dimensions as the TO 220 device and capable of resisting voltages equal to or greater than 2250 V AC. This is done while fully complying with applicable international standards.
Another object is to provide a device which is economical, reliable, and safe.
Therefore, in accordance with the present invention, a package for semiconductor devices is encapsulated in an insulating resin. Multiple conductive leads project from one side of the package. Alternating leads are provided with an insulating coating which projects along a portion of their length. Leads which are not insulated are bent so as to displace them from the plane of the coated leads and space them further away from the coated leads. The bent leads are displaced a sufficient distance to provide a separation in air consistent with spacing standards for high voltage devices.
REFERENCES:
patent: 4617585 (1986-10-01), Yasui
patent: 4951124 (1990-08-01), Sawaya
patent: 5113240 (1992-05-01), Bozzini et al.
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Mangiagli Marcantonio
Pogliese Rosario
Consorzio per la Ricerca sulla Microelectronica nel Mezzogiorno
Lee Eddie
Warren Matthew E.
LandOfFree
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