Process for encapsulating a semiconductor device having a heat s

Details Process for encapsulating a semiconductor device having a heat s Process for encapsulating a semiconductor device having a heat s

1995-02-06

1998-06-16

Graybill, David

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

438122, 438123, 438124, 438127, 26427217, H01L 2156, H01L 2158, H01L 21603

Patent

active

057669856

ABSTRACT:
A process for making a package for discrete semiconductor devices, wherein the insulating characteristics of the package are increased by introducing cuts, grooves and positioning holes in the metal plate and shaping in the retractable positioning pins of the metal plate in the molding die.

REFERENCES:
patent: 3715423 (1973-02-01), Dunn
patent: 4266267 (1981-05-01), Ruegg
patent: 4835423 (1989-05-01), de Ferron et al.
patent: 4888307 (1989-12-01), Spairisano
patent: 5063434 (1991-11-01), Emoto
patent: 5105259 (1992-04-01), McShane et al.

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