Integrated structure pad assembly for lead bonding

Details Integrated structure pad assembly for lead bonding Integrated structure pad assembly for lead bonding

1995-06-07

1999-03-30

Graybill, David

Semiconductor device manufacturing: process

Introduction of conductivity modifying dopant into...

Diffusing a dopant

438546, 438597, 438611, 438612, 438621, H01L 2128, H01L 2122, H01L 2160

Patent

active

058888896

ABSTRACT:
A process for manufacturing an integrated structure pad assembly for wire bonding to a power semiconductor device chip including a chip portion having a top surface covered by a metallization layer which has a first sub-portion wherein functionally active elements of the power device are present. The chip portion has at least one second sub-portion wherein no functionally active elements of the power device are present. The top surface of the at least one second sub-portion is elevated with respect to the first sub-portion to form at least one protrusion which forms a support surface for a wire.

REFERENCES:
patent: 3434019 (1969-03-01), Carley
patent: 3667008 (1972-05-01), Katnack
patent: 3831067 (1974-08-01), Wislocky et al.
patent: 4008486 (1977-02-01), Byczkowski
patent: 4015278 (1977-03-01), Fukuta
patent: 4017886 (1977-04-01), Tomono et al.
patent: 4055884 (1977-11-01), Jambotkar
patent: 4070690 (1978-01-01), Wickstrom
patent: 4145700 (1979-03-01), Jambotkar
patent: 4236171 (1980-11-01), Shen
patent: 4305087 (1981-12-01), Wislocky
patent: 4329642 (1982-05-01), Luthi et al.
patent: 4376286 (1983-03-01), Lidow et al.
patent: 4399449 (1983-08-01), Herman et al.
patent: 4412242 (1983-10-01), Herman et al.
patent: 4414560 (1983-11-01), Lidow
patent: 4556896 (1985-12-01), Meddles
patent: 4574208 (1986-03-01), Lade et al.
patent: 4593302 (1986-06-01), Lidow et al.
patent: 4606998 (1986-08-01), Clodgo et al.
patent: 4638553 (1987-01-01), Nilarp
patent: 4639762 (1987-01-01), Neilson et al.
patent: 4641418 (1987-02-01), Meddles
patent: 4642419 (1987-02-01), Meddles
patent: 4651181 (1987-03-01), Ge Rard
patent: 4663820 (1987-05-01), Ionescn
patent: 4680853 (1987-07-01), Lidow et al.
patent: 4723197 (1988-02-01), Takiar et al.
patent: 4789882 (1988-12-01), Lidow
patent: 4794431 (1988-12-01), Park
patent: 4845545 (1989-07-01), Abramowitz et al.
patent: 4853762 (1989-08-01), Ewer et al.
patent: 4878099 (1989-10-01), Nilarp
patent: 4881106 (1989-11-01), Barron
patent: 4890142 (1989-12-01), Tonnel et al.
patent: 4965173 (1990-10-01), Gould
patent: 5016066 (1991-05-01), Takahashi
patent: 5047833 (1991-09-01), Gould
patent: 5130767 (1992-07-01), Lidow et al.
patent: 5153507 (1992-10-01), Fong et al.
patent: 5250821 (1993-10-01), Ferla et al.
patent: 5365112 (1994-11-01), Ohshima
European Search Report from European Patent Application No. 93830523.2, filed Dec. 24, 1993.
Patent Abstracts of Japan, vol. 17, No. 570 (E-1448) Oct. 1993 & JP-A-05167070 NEC Kansai Ltd.

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