Integrated structure pad assembly for lead bonding

Details Integrated structure pad assembly for lead bonding Integrated structure pad assembly for lead bonding

1994-12-21

1997-01-07

Jackson, Jr., Jerome

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Configuration or pattern of bonds

257341, 257784, 257785, H01L 2941, H01L 2978

Patent

active

055920268

ABSTRACT:
An integrated structure pad assembly for wire bonding to a power semiconductor device chip including a chip portion having a top surface covered by a metallization layer which has a first sub-portion wherein functionally active elements of the power device are present. The chip portion has at least one second sub-portion wherein no functionally active elements of the power device are present. The top surface of the at least one second sub-portion is elevated with respect to the first sub-portion to form at least one protrusion which forms a support surface for a wire.

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