4. Semiconductor device manufacturing: process
  5. With measuring or testing
  6. Packaging or treatment of packaged semiconductor

Manickam Thavarajah

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Apparatus and method for testing a flip chip integrated circuit

Semiconductor device manufacturing: process – With measuring or testing – Packaging or treatment of packaged semiconductor
Patent

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Direct positive image photo-resist transfer of substrate design

Etching a substrate: processes – Forming pattern using lift off technique
Reexamination Certificate

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Electromagnetic interference package protection

Active solid-state devices (e.g. – transistors – solid-state diode – With shielding
Reexamination Certificate

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Electronic organic substrate

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate

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Electronic substrate

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate

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Profile ID: LFUS-PAI-P-206440

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