Direct positive image photo-resist transfer of substrate design

Details Direct positive image photo-resist transfer of substrate design Direct positive image photo-resist transfer of substrate design

2005-03-29

2005-03-29

Vinh, Lan (Department: 1765)

Etching a substrate: processes

Forming pattern using lift off technique

C216S041000, C216S042000, C427S259000

Reexamination Certificate

active

06872321

ABSTRACT:
A method of forming a photo-resist image on a substrate, such as a conductive film. The method provides that a photo-resist image is printed directly onto the conductive film, such as by using an ink jet printer. Specifically, a CAD image may be sent from a computer to the ink jet printer, and the ink jet printer may use the CAD image to print the photo-resist image. The method may provide that a copper film is applied to a dielectric substrate, and then the photo-resist image is printed directly onto the copper film. Then, at least a portion of the copper film is removed, such as by etching, and at least a portion of the photo-resist image which has been printed on the copper film is removed, such as by etching. By printing the photo-resist image directly onto the copper film, it is not necessary to perform steps such as: applying a mask, exposing to UV light, and developing.

REFERENCES:
patent: 4790902 (1988-12-01), Wada et al.
patent: 5738916 (1998-04-01), Noguchi et al.
patent: 6503831 (2003-01-01), Speakman

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