Active solid-state devices (e.g. – transistors – solid-state diode – With shielding
Reexamination Certificate
2005-03-15
2005-03-15
Nelms, David (Department: 2818)
Active solid-state devices (e.g., transistors, solid-state diode
With shielding
C257S422000, C257S660000, C257S678000, C257S787000, C438S106000, C438S112000, C438S124000, C438S126000, C438S127000, C438S795000
Reexamination Certificate
active
06867480
ABSTRACT:
A method of shielding an integrated circuit from electromagnetic interference. The integrated circuit is at least partially encapsulated within an electromagnetic interference resistant molding compound, and then the integrated circuit is completely encapsulated within a second molding compound. In this manner, the electromagnetic interference resistant molding compound protects the integrated circuit from electromagnetic interference, while the second molding compound can be selected for properties traditionally desired in a molding compound, such as thermal, electrical insulating, and structural properties. Thus, the integrated circuit according to the present invention can be placed closer to structures, such as power supplies, which produce electromagnetic interference, without experiencing an unacceptable degradation of performance due to the electromagnetic interference caused by the structures.
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Legaspi, Jr. Severino A.
Othieno Maurice O.
Patel Pradip D.
Thavarajah Manickam
Huynh Andy
LSI Logic Corporation
Luedeka Neely & Graham P.C.
Nelms David
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