4. Semiconductor device manufacturing: process
  5. Coating with electrically or thermally conductive material
  6. To form ohmic contact to semiconductive material

Lynne Marie Gignac

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Aluminum-based metallization exhibiting reduced...

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Control of liner thickness for improving thermal cycle...

Semiconductor device manufacturing: process – With measuring or testing
Reexamination Certificate

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Control of liner thickness for improving thermal cycle...

Active solid-state devices (e.g. – transistors – solid-state diode – Test or calibration structure
Reexamination Certificate

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Method for forming a TiN layer on top of a metal silicide...

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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On-chip Cu interconnection using 1 to 5 nm thick metal cap

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2493137

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