Control of liner thickness for improving thermal cycle...

Semiconductor device manufacturing: process – With measuring or testing

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C438S637000, C438S638000, C438S672000, C438S673000, C438S700000

Reexamination Certificate

active

06989282

ABSTRACT:
A device, system and method for evaluating reliability of a semiconductor chip are disclosed. Strain is determined at a location of interest in a structure. Failures are evaluated in a plurality of the structures after stress cycling to determine a strain threshold with respect to a feature characteristic. Structures on a chip or chips are evaluated based on the feature characteristic to predict reliability based on the strain threshold and the feature characteristic. Predictions and design changes may be made based on the results.

REFERENCES:
patent: 2005/0186689 (2005-08-01), Filippi et al.
U.S. Appl. No. 10/726,140, Hichri et al.
Hance H. Huston and C. Patrick Clarke; “Reliability Defect Detection and Screening during Processing—Theory and Implementation”; IEEE/IRPS; Jan. 1992; pp. 268-275.
R. G. Filippi et al.; “Thermal Cycle Reliability of Stacked Via Structures with Copper Metallization of an Organic Low-K Dielectric”; sent in Oct. 2003 to International Reliability Physics Symposium committee for later publishing; 4 pages (including 2004 IRPS Submission Cover Page and article).
R. G. Filippi et al.; “Thermal Cycle Reliability of Stacked Via Structures with Copper Metallization and an Organic Low-K Dielectric”; IBM Hopewell Junction, NY Yorktown Heights, NY, Essex Junction, VT; Feb. 20, 2004; 7 pages.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Control of liner thickness for improving thermal cycle... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Control of liner thickness for improving thermal cycle..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Control of liner thickness for improving thermal cycle... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3548603

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.