4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Housing or package
  6. Portion of housing of specific materials

Ludwig Heitzer

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Electronic circuit in a package-on-package configuration and...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
Reexamination Certificate

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Method for coating a structure comprising semiconductor chips

Semiconductor device manufacturing: process – Coating of substrate containing semiconductor region or of...
Reexamination Certificate

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Method for manufacturing an electronic component and...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified configuration
Reexamination Certificate

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Plastic housing and semiconductor component with said...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Portion of housing of specific materials
Reexamination Certificate

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Semiconductor device with a thinned semiconductor chip and...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2205317

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