Method for coating a structure comprising semiconductor chips

Details Method for coating a structure comprising semiconductor chips Method for coating a structure comprising semiconductor chips

2006-08-16

2009-06-16

Lebentritt, Michael S (Department: 2829)

Semiconductor device manufacturing: process

Coating of substrate containing semiconductor region or of...

C438S780000, C438S781000, C257SE23077

Reexamination Certificate

active

07547645

ABSTRACT:
A method for coating a structure that includes at least one semiconductor chip involves electrostatically depositing coating particles on the areas of the structure to be coated. The coating particles are first applied to a carrier and the latter is electrostatically charged with the coating particles. The structure including at least one semiconductor chip is charged electrostatically to a polarity opposite to the carrier. The carrier and/or the structure are then moved towards one another in the direction of an area of the structure to be coated until the coating particles jump to the areas of the structure to be coated and adhere there. The coating particles are liquefied by heating the area with coating particles to form a coating.

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