Electronic circuit in a package-on-package configuration and...

Details Electronic circuit in a package-on-package configuration and... Electronic circuit in a package-on-package configuration and...

2007-07-20

2010-02-16

Nguyen, Dao H (Department: 2818)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Reexamination Certificate

active

07662664

ABSTRACT:
An electronic circuit in a package-on-package configuration includes: a lower subassembly with a first electronic element, a first wiring carrier, a first housing with a first redistribution layer and an arrangement of solder balls disposed on the first redistribution layer and an upper subassembly with a second electronic element mounted on the lower subassembly. A method for producing the electronic circuit in a package-on-package configuration includes: adhering an upper side of the first electronic element to an underside of the first redistribution layer via a radiation-crosslinking thermoplastic adhesive.

REFERENCES:
patent: 6025648 (2000-02-01), Takahashi et al.
patent: 2007/0040261 (2007-02-01), Hetzel et al.
patent: 0611129 (1994-08-01), None
patent: 0611129 (1994-08-01), None
patent: 1308179 (2003-05-01), None
patent: 03032370 (2003-04-01), None

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