Semiconductor device with a thinned semiconductor chip and...

Details Semiconductor device with a thinned semiconductor chip and... Semiconductor device with a thinned semiconductor chip and...

2007-11-13

2007-11-13

Potter, Roy (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

C257S618000

Reexamination Certificate

active

11465547

ABSTRACT:
A semiconductor device with a thinned semiconductor chip and a method for producing the latter is disclosed. In one embodiment, the thinned semiconductor chip has a top side with contact areas and a rear side with a rear side electrode. In this case, the rear side electrode is cohesively connected to a chip pad of a circuit carrier via an electrically conductive layer. In another embodiment, the thinned semiconductor chips of this semiconductor device according to the invention have low-microdefect edge side regions with semiconductor element structures and edge sides patterned by etching technology.

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patent: 7211900 (2007-05-01), Shin et al.
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patent: 10048881 (2002-03-01), None
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patent: 10120408 (2002-10-01), None
patent: 102004009742 (2005-09-01), None

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