Method for manufacturing an electronic component and...

Details Method for manufacturing an electronic component and... Method for manufacturing an electronic component and...

2007-05-09

2010-11-16

Ngo, Ngan (Department: 2893)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified configuration

C257S783000, C257SE23127

Reexamination Certificate

active

07834460

ABSTRACT:
The invention pertains to a method for manufacturing an electronic component with a semiconductor element (1) that is contacted and fixed on a substrate surface (2). The method is characterized in that the rear side of the semiconductor element and/or the substrate surface is coated with an adhesive structure consisting of a first component (3) that solidifies, particularly hardens or cures, and an electrically conductive second component (4) that does not solidify, wherein the semiconductor element is bonded to the substrate surface in a contacting fashion. The electronic component is characterized in that a structured adhesive layer arranged between the semiconductor element and the substrate surface comprises a solidifying first component (3) and an electrically conductive non-solidifying second component (4).

REFERENCES:
patent: 6940156 (2005-09-01), Bauer et al.
patent: 7538415 (2009-05-01), Lin et al.
patent: 2006/0278993 (2006-12-01), Trezza et al.
patent: 2007/0182020 (2007-08-01), Trezza et al.
patent: 0779653 (1997-06-01), None
patent: 05062981 (1993-03-01), None

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