Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Portion of housing of specific materials
Reexamination Certificate
2011-04-05
2011-04-05
Mulpuri, Savitri (Department: 2812)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Portion of housing of specific materials
C257SE23114, C438S125000
Reexamination Certificate
active
07919857
ABSTRACT:
A plastic housing includes plastic external faces and the underside of the plastic housing comprises external contact areas on which external contacts are arranged. The plastic external faces are covered by a closed metal layer apart from the underside, wherein the boundary layer between plastic external faces and the closed metal layer includes exposed electrically conductive inclusions of the plastic of the housing.
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Nils Heininger et al., “Fertigung von MID Bauteilen vom Rapid Prototyping bis zur Serie mit innovativer LDS-Technologie,” Ricone Symposium, Oct. 1, 2003, Murnau, Germany; XP-002395995.
Bauer Michael
Heitzer Ludwig
Pohl Jens
Strobel Peter
Stuempfl Christian
Choi Calvin
Edell Shapiro & Finnan LLC
Infineon - Technologies AG
Mulpuri Savitri
LandOfFree
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