4. Electricity: conductors and insulators
  5. Conduits, cables or conductors
  6. Preformed panel circuit arrangement

Lu-Chen Hwan

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Compound filled in lead IC packaging product

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated
Reexamination Certificate

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Method for forming wiring on a substrate

Etching a substrate: processes – Forming or treating electrical conductor article – Adhesive or autogenous bonding of self-sustaining preforms
Reexamination Certificate

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Method for making cable with a conductive bump array, and...

Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement
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Method for making cable with a conductive bump array, and...

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
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Package structure for integrated circuit device and method...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Making plural separate devices
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Profile ID: LFUS-PAI-P-2210460

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