Method for forming wiring on a substrate

Details Method for forming wiring on a substrate Method for forming wiring on a substrate

2004-06-25

2008-08-19

Olsen, Allan (Department: 1792)

Etching a substrate: processes

Forming or treating electrical conductor article

Adhesive or autogenous bonding of self-sustaining preforms

C216S036000, C216S041000

Reexamination Certificate

active

07413670

ABSTRACT:
A method for forming a wiring on a substrate includes the steps of preparing a copper substrate, plating a copper-nickel layer on a portion of the copper substrate, combining the copper substrate with a soft polyimide substrate, and etching the copper substrate.

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