Method for making cable with a conductive bump array, and...

Details Method for making cable with a conductive bump array, and... Method for making cable with a conductive bump array, and...

2007-12-25

2007-12-25

Lebentritt, Michael (Department: 2812)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C257SE21508

Reexamination Certificate

active

11106151

ABSTRACT:
A cable with conductive bumps is fabricated by forming a photoresist layer with multiple openings on a cable substrate, coating a conductive layer on the photoresist layer whereby the conductive layer in the openings forms the bumps at circuits on the cable substrate, and then removing the photoresist layer. When connecting the cable to a task object such as an LCD glass substrate or PCB, only a usual non-conductive paste is applied to join the cable and the task object, without use of expensive anisotropic-conductive paste or film.

REFERENCES:
patent: 4584039 (1986-04-01), Shea
patent: 4909909 (1990-03-01), Florjancic et al.
patent: 6653235 (2003-11-01), Liang et al.
patent: 6864119 (2005-03-01), Seko
patent: 7019393 (2006-03-01), Toriyama
patent: 488052 (2001-05-01), None

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