Method for making cable with a conductive bump array, and...

Details Method for making cable with a conductive bump array, and... Method for making cable with a conductive bump array, and...

2011-08-16

2011-08-16

Norris, Jeremy C (Department: 2835)

Electricity: conductors and insulators

Conduits, cables or conductors

Preformed panel circuit arrangement

C174S268000, C361S777000

Reexamination Certificate

active

07999191

ABSTRACT:
A cable with conductive bumps is fabricated by forming a photoresist layer with multiple openings on a cable substrate, coating a conductive layer on the photoresist layer whereby the conductive layer in the openings forms the bumps at circuits on the cable substrate, and then removing the photoresist layer. When connecting the cable to a task object such as an LCD glass substrate or PCB, only a usual non-conductive paste is applied to join the cable and the task object, without use of expensive anisotropic-conductive paste or film.

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patent: 6864119 (2005-03-01), Seko
patent: 7019393 (2006-03-01), Toriyama
patent: 488052 (2001-05-01), None

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