Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Making plural separate devices
Reexamination Certificate
2011-05-17
2011-05-17
Tran, Thien F (Department: 2895)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Making plural separate devices
C438S460000, C438S462000, C257SE21499
Reexamination Certificate
active
07943426
ABSTRACT:
The present invention discloses a package structure for an integrated circuit device and method for manufacturing the same. The method includes providing a wafer with multiple integrated circuit devices; providing an extendable substrate having a first surface supporting the wafer; forming multiple anti-elongation layers on a second surface of the extendable substrate, the second surface being opposite to the first surface; forming multiple recesses in the wafer for separating the integrated circuit devices from each other; elongating the extendable substrate to enlarge the multiple recesses; and forming an insulating layer to fill the recesses and cover multiple integrated circuit devices.
REFERENCES:
patent: 2006/0286718 (2006-12-01), Ozaki
patent: 2681355 (2005-02-01), None
Mutual-Pak Technology Co. Ltd.
Snell & Wilmer L.L.P.
Tran Thien F
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