Package structure for integrated circuit device and method...

Details Package structure for integrated circuit device and method... Package structure for integrated circuit device and method...

2011-05-17

2011-05-17

Tran, Thien F (Department: 2895)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Making plural separate devices

C438S460000, C438S462000, C257SE21499

Reexamination Certificate

active

07943426

ABSTRACT:
The present invention discloses a package structure for an integrated circuit device and method for manufacturing the same. The method includes providing a wafer with multiple integrated circuit devices; providing an extendable substrate having a first surface supporting the wafer; forming multiple anti-elongation layers on a second surface of the extendable substrate, the second surface being opposite to the first surface; forming multiple recesses in the wafer for separating the integrated circuit devices from each other; elongating the extendable substrate to enlarge the multiple recesses; and forming an insulating layer to fill the recesses and cover multiple integrated circuit devices.

REFERENCES:
patent: 2006/0286718 (2006-12-01), Ozaki
patent: 2681355 (2005-02-01), None

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