4. Semiconductor device manufacturing: process
  5. Coating with electrically or thermally conductive material
  6. To form ohmic contact to semiconductive material

Loi N. Nguyen

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Dual landing pad structure in an integrated circuit

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Patent

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Dual landing pad structure including dielectric pocket

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead
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Integrated circuit contact structure having gate electrode prote

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified configuration
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Method for forming contact plugs in integrated circuits

Etching a substrate: processes – Forming or treating electrical conductor article – Forming or treating of groove or through hole
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Method of forming a landing pad structure in an integrated circu

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Patent

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Profile ID: LFUS-PAI-P-198107

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