4. Metal working
  5. Method of mechanical manufacture
  6. Electrical device making

Kyoung-Sei Choi

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Circuit film with bump, film package using the same, and...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
Reexamination Certificate

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CMOS type image sensor module having transparent polymeric...

Active solid-state devices (e.g. – transistors – solid-state diode – Responsive to non-electrical signal – Electromagnetic or particle radiation
Reexamination Certificate

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Flip chip packages

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
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Method for manufacturing tape wiring board

Metal working – Method of mechanical manufacture – Electrical device making
Reexamination Certificate

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Method for manufacturing tape wiring board

Metal working – Method of mechanical manufacture – Electrical device making
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2170652

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