Metal working – Method of mechanical manufacture – Electrical device making
Reexamination Certificate
2011-03-01
2011-03-01
Nguyen, Donghai D. (Department: 3729)
Metal working
Method of mechanical manufacture
Electrical device making
C029S830000, C264S259000
Reexamination Certificate
active
07895742
ABSTRACT:
A method for manufacturing a tape wiring board in accordance with the present invention may employ an imprinting process in forming a wiring pattern thereby reducing the number of processes for manufacturing a tape wiring board and allowing the manufacturing process to proceed in a single production line. Therefore, the manufacturing time and cost may be reduced. A profile of the wiring pattern may be determined by the shape of an impression pattern of a mold. This may establish the top width of inner and outer leads and incorporate fine pad pitch. Although ILB and OLB process may use an NCP, connection reliability may be established due to the soft and elastic wiring pattern.
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English language translation of Korean Publication No. 2002-0095505.
English language translation of Korean Publication No. 2003-0019977.
English language translation of Japanese Publication No. 2003-331662.
Choi Kyoung-Sei
Kang Sa-Yoon
Kwon Yong-hwan
Lee Chung-Sun
Muir Patent Consulting, PLLC
Nguyen Donghai D.
Samsung Electronics Co,. Ltd.
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